Designed for high-power electronic devices, this copper heatsink maximizes thermal conductivity. Copper is notoriously difficult to machine due to its ductility ("gumminess"), but it offers superior heat dissipation compared to aluminum. This product showcases our ability to handle challenging materials for functional applications.
We use sharp, polished carbide tools and specific cutting strategies to prevent the soft copper from sticking to the cutter (built-up edge).
The tall, thin cooling fins are machined with high aspect ratios. We carefully control feed rates to prevent the fins from bending during the cutting process.
The base contact area is fly-cut to achieve extreme flatness and a mirror-like finish, ensuring maximum thermal transfer efficiency with the CPU or heat source.
Copper (approx. 400 W/m·K) transfers heat almost twice as fast as Aluminum.
CNC machining allows for custom fin shapes and mounting holes that extrusion cannot achieve.
Can be treated with anti-oxidation coating or nickel plating to prevent tarnishing over time.
Ideal for lasers, 5G base stations, and high-performance computing (HPC) cooling.
Don't let tolerance stack-up delay your product launch. Submit your project details, and our engineering team will evaluate your design for manufacturability before the first cut.
CNC allows for prototypes, low volumes, and complex 3D shapes (like pin fins) that extrusion cannot produce.
We can suggest hybrid designs (Copper base + Aluminum fins) or optimize the design to reduce machining time.
We vacuum pack parts immediately after cleaning and can apply clear passivation, anti-oxidation coatings, or nickel plating.
We use specialized polished carbide cutters, optimized high-speed tool paths, and tailored feed rates to minimize tool pressure against high-aspect-ratio fins.
Through precision fly-cutting processes, we achieve ultra-flat and mirror-like contact surfaces, maximizing thermal interface contact with heat sources.
They are ideal for high heat-flux density hardware, such as industrial laser systems, 5G RF power amplifiers, and high-performance computing (HPC) modules.