Explore our custom OEM engineering parts designed to integrate with high-density electronics, optical brackets, high-speed rollers, and structural assemblies.
As 5G Advanced, autonomous ADAS compute modules, satellite communications, and high-frequency IoT hardware push operating bands beyond 40 GHz, the mechanical and electromagnetic demands on custom shielding cans have fundamentally shifted.
Procurement engineers in defense, telecommunications, and high-speed computing now specify isolation thresholds exceeding 70 dB across broad multi-octave ranges. Standard catalogue cans fail due to parasitic aperture resonance. Custom deep-drawn, stamped, and CNC cavity shielding cans isolate sensitive Low-Noise Amplifiers (LNAs), Power Amplifiers (PAs), and baseband chips while preserving impedance integrity across high-density PCB layouts.
High-speed pick-and-place packaging requires shielding can coplanarity held within ≤0.08 mm to prevent solder bridging or opens during automated reflow. Sunmy implements precision progressive die stamping and custom vacuum-nest packaging (Tape & Reel) that eliminates post-forming spring-back and guarantees perfect planarity for automated high-volume PCB assembly lines.
Modern RF transceivers generate severe local heat fluxes. Custom shielding cans engineered by our team feature strategically arrayed perforations sized beneath cutoff frequencies (λ/20 rule) to enable convective heat dissipation without leaking millimeter-wave radiation. We balance thermal conductivity with shielding efficacy via hybrid multi-metal laminates and localized thermal interface pads.
Selecting the ideal raw substrate defines shielding attenuation, solderability, formability, and mechanical durability against harsh environmental conditions.
| Material Substrate | Shielding Spectrum | Permeability (μ) / Conductivity | Solderability & Surface Treatment | Primary Industrial Use-Case |
|---|---|---|---|---|
| Nickel Silver (C77000 / C7521) | 100 kHz – 18 GHz | Conductivity: ~5.5% IACS; Non-magnetic | Direct solderability without post-plating; Zero whisker risk | Mobile handsets, Wi-Fi 7 modules, optical transceivers, medical sensors |
| Tin-Plated Cold Rolled Steel (SPTE) | DC – 1 GHz (Magnetic & Electric) | High magnetic permeability (μr ~100-300) | Pre-plated electrolytic tin with anti-tarnish passivate | Power supplies, automotive controllers, low-frequency inductors |
| Mu-Metal / High Permeability Alloys | DC – 100 kHz (Extremely Low Freq) | Ultra-high initial permeability (μr > 20,000) | Hydrogen atmospheric annealing required post-stamping | High-end audio, CRT assemblies, cryogenic & laboratory flux isolation |
| Beryllium Copper (C17200) / Phos Bronze | 1 MHz – 40 GHz | Conductivity: 22-28% IACS; High elasticity | Electroless nickel, bright tin, gold or silver plating | Snap-on two-piece shielding frames, contact fingers, spring latches |
| Aluminum 6061-T6 / 5052-H32 (CNC Cavity) | 1 GHz – 100 GHz+ | Conductivity: ~40% IACS; High rigidity | SurTec 650, clear chromate, electroless nickel, conductive anodize | Radar modules, aerospace satellite transponders, 5G base stations |
From single-piece disposable prototypes to modular multi-cavity labyrinth enclosures, we configure manufacturing lines based on production scale and rework requirements.
Cost-optimized solutions formed via progressive dies with castellations and pre-soldered tabs. Best for high-volume consumer electronics where components beneath the shield require zero field serviceability or post-assembly rework.
Features an automated SMT reflow frame soldered to the PCB ground ring and an engineered snap-on cover with spring retention dimples. Allows quick removal for board-level testing, calibration, tuning, and chip re-work without desoldering.
Engineered from billet aluminum or copper for ultra-high isolation (>90 dB) across multiple RF sub-circuits. CNC milled wall fences with form-in-place (FIP) conductive silicone gaskets eliminate cross-talk between transmitter and receiver stages.
Delivering qualified shielding cans and precision hardware for demanding industrial sectors across Europe, North America, and Asia-Pacific.
High-voltage Silicon Carbide (SiC) switching induces massive EMI in electric vehicles. Our shielding cans protect LiDAR processors, 77 GHz radar circuits, and battery management sensor lines under rigorous thermal shock.
Low-Earth-Orbit satellite transponders demand extreme weight minimization paired with radiation hardness. We produce thin-wall titanium and aluminum CNC housings with conductive nickel-gold barrier finishes.
Surgical telemetry and patient-monitoring wearables operate in environments congested with RF noise. Our non-magnetic brass and phosphor bronze cans maintain reliable zero-distortion sensor readings.
From factory floor automation to dense server racks, our stamped steel and turned copper hardware suppress harmonic oscillations produced by motor servos, variable frequency drives, and multi-core processors.
Anticipating higher spectral frequencies and sub-millimeter component miniaturization through continuous R&D investments.
As experimental communications migrate above 100 GHz into the Sub-THz spectrum, skin depth decreases dramatically. We are standardizing nanometer-scale surface roughness polishing (≤Ra 0.2 μm) inside shielding pockets to minimize microwave surface losses and phase jitter in high-frequency waveguides.
Modern data center switches require shielding enclosures engineered with integrated fiber optic feedthrough slots and integrated heat pipes. Our R&D incorporates dual-function shielding designs that simultaneously serve as the mechanical heat spreader and micro-aperture Faraday cage.
Aligning with European CBAM regulations and circular economy directives, Sunmy guarantees 100% recycled high-grade copper alloys, non-toxic trivalent passivates, and cold-stamping lines driven entirely by high-efficiency servo-electric presses.
Shenzhen Sunmy Hardware Co., Ltd. delivers direct engineering-to-engineering collaboration with transparent export documentation.
Every shipment includes complete Mill Test Certificates (MTC), First Article Inspection (FAI) reports mapped to 2D prints, coordinate measuring machine (CMM) dimensional verification charts, and RoHS / REACH compliance statements.
We sign enforceable Non-Disclosure Agreements prior to receiving sensitive CAD, STEP, or DXF files. Direct communication with our Shenzhen manufacturing plant eliminates third-party trading intermediaries, protecting your proprietary hardware blueprints.
Our engineers provide comprehensive Design for Manufacturability (DFM) reviews within 24 hours. Rapid soft-tooled prototypes and CNC prototype shielding cans are fabricated and shipped via air express in as fast as 3 to 7 working days.
Explore our custom-engineered precision turned sleeves, optical housings, manifolds, and electrode components built for extreme reliability.
In-depth technical clarifications addressing RF simulation, aperture geometry, surface solderability, and tooling lead times.
Send your 2D/3D engineering drawings (.STEP, .IGS, .DWG, .PDF) to our Shenzhen manufacturing team. Receive an exhaustive DFM analysis, material options, and a direct quote within 24 hours.